The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2014
Filed:
Mar. 14, 2013
Samsung Electronics Co., Ltd., Suwon-si, KR;
Ju-il Choi, Suwon-si, KR;
Jeong-Woo Park, Suwon-si, KR;
Jeonggi Jin, Osan-si, KR;
Yeun-Sang Park, Yongin-si, KR;
Abstract
Provided are electrical interconnections and methods for fabricating the same. The electrical interconnection may include a substrate including a bonding pad, a solder ball electrically connected to the bonding pad, a solder supporter on the bonding pad, a portion of the solder ball filling the solder supporter, and a metal layer between the bonding pad and the solder supporter, the metal layer having an ionization tendency lower than the bonding pad.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile