The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2014
Filed:
Apr. 01, 2013
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/85 (2013.01); H01L 24/89 (2013.01);
Abstract
A method of assembling semiconductor devices includes applying a metal paste including a plurality of metal particles having an average size less than 50 nanometers and a binder material onto a metal terminal of a package substrate. The metal paste is processed including a heat up step in a reducing gas atmosphere and then a vacuum sintering step at a temperature of at least 200° C. for forming a sintered metal coating. A semiconductor die is attached onto a die attach area of the package substrate. A bond wire is then connected between a bond pad on the semiconductor die and the sintered metal coating on the metal terminal.