The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2014
Filed:
Sep. 04, 2012
Applicants:
Ralf Otremba, Kaufbeuren, DE;
Bernd Roemer, Bernhardswald, DE;
Erich Griebl, Dorfen, DE;
Fabio Brucchi, Villach, AT;
Inventors:
Ralf Otremba, Kaufbeuren, DE;
Bernd Roemer, Bernhardswald, DE;
Erich Griebl, Dorfen, DE;
Fabio Brucchi, Villach, AT;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
A chip package is provided, the chip package including: a carrier including at least one cavity; a chip disposed at least partially within the at least one cavity; at least one intermediate layer disposed over at least one side wall of the chip; wherein the at least one intermediate layer is configured to thermally conduct heat from the chip to the carrier.