The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2014
Filed:
Sep. 02, 2010
Takuya Kadoguchi, Toyota, JP;
Yoshikazu Suzuki, Toyota, JP;
Masaya Kaji, Toyota, JP;
Kiyofumi Nakajima, Chigasaki, JP;
Tatsuya Miyoshi, Nagoya, JP;
Takanori Kawashima, Anjo, JP;
Tomomi Okumura, Toyota, JP;
Takuya Kadoguchi, Toyota, JP;
Yoshikazu Suzuki, Toyota, JP;
Masaya Kaji, Toyota, JP;
Kiyofumi Nakajima, Chigasaki, JP;
Tatsuya Miyoshi, Nagoya, JP;
Takanori Kawashima, Anjo, JP;
Tomomi Okumura, Toyota, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota-Shi, JP;
Abstract
A semiconductor module which includes a semiconductor device; a wiring member that is connected to the semiconductor device; a cooling plate that includes a first surface on a side of the semiconductor device and a second surface on a side opposite to the first surface and has a fastening portion at an end thereof in a first direction; and a molded portion that is formed by molding a resin on the semiconductor device, the wiring member and the cooling plate, wherein the fastening portion is exposed out of the molded portion, and a terminal portion of the wiring member is exposed out of the molded portion such that the terminal portion of the wiring member extends in a second direction which is substantially perpendicular to the first direction.