The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2014
Filed:
Sep. 15, 2012
Applicants:
Yasutaka Nakashiba, Kanagawa, JP;
Kenta Ogawa, Kanagawa, JP;
Inventors:
Yasutaka Nakashiba, Kanagawa, JP;
Kenta Ogawa, Kanagawa, JP;
Assignee:
Renesas Electronics Corporation, Kawasaki-shi, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device, includes a substrate with a first surface, a semiconductor chip disposed over the first surface of the substrate, the semiconductor chip including a first region and a second region, and an encapsulant resin formed over the first surface of the substrate and encapsulating the semiconductor chip. The encapsulant resin has a thickness that is less at the first region of the semiconductor chip than that at the second region.