The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2014
Filed:
Feb. 07, 2013
Samsung Electro-mechanics Co., Ltd., Gyunggi-do, KR;
Jae Hyun Lim, Gyunggi-do, KR;
Chang Seob Hong, Gyunggi-do, KR;
Young Hoon Kwak, Gyunggi-do, KR;
Young Ho Sohn, Gyunggi-do, KR;
Samsung Electro-Mechanics, Co., Ltd., Suwon, Gyunggi-Do, KR;
Abstract
There is provided a semiconductor package including: a lead frame having an electronic component mounted on one surface thereof; a heat dissipation substrate disposed downwardly of the lead frame; an insulating member disposed upwardly of the electronic component such that the electronic components are electrically connected to one another; a conductive member disposed between the insulating member and the lead frame and electrically connecting the electronic component to the lead frame; and a molded portion hermetically sealing the insulating member and the heat dissipation substrate.