The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2014
Filed:
Apr. 13, 2012
Applicants:
John Pease, San Mateo, CA (US);
Neil Benjamin, East Palo Alto, CA (US);
Inventors:
John Pease, San Mateo, CA (US);
Neil Benjamin, East Palo Alto, CA (US);
Assignee:
Lam Research Corporation, Fremont, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05B 3/68 (2006.01); B23K 15/02 (2006.01); B23K 13/08 (2006.01); H05B 1/02 (2006.01); H05B 3/54 (2006.01); H05B 3/40 (2006.01); H05B 3/02 (2006.01); H05B 3/16 (2006.01); H05B 3/44 (2006.01); H05B 3/10 (2006.01); A21B 2/00 (2006.01); D02J 13/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of operating a heating plate for a substrate support assembly used to support a semiconductor substrate in a semiconductor processing apparatus, wherein the heating plate comprises power supply lines and power return lines and respective heater zone connected between every pair of power supply line and power return line. The method reduces maximum currents carried by the power supply lines and power return lines by temporally spreading current pulses for powering the heater zones.