The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2014

Filed:

Feb. 14, 2012
Applicants:

Chih-hui Weng, Tainan, TW;

Wei-sheng Yun, Taipei, TW;

Shao-ming Yu, Zhubei, TW;

Hsin-chih Chen, Tucheng, TW;

Chih-hsin Ko, Fongshan, TW;

Clement Hsingjen Wann, Carmel, NY (US);

Inventors:

Chih-Hui Weng, Tainan, TW;

Wei-Sheng Yun, Taipei, TW;

Shao-Ming Yu, Zhubei, TW;

Hsin-Chih Chen, Tucheng, TW;

Chih-Hsin Ko, Fongshan, TW;

Clement Hsingjen Wann, Carmel, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods of manufacturing semiconductor devices are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes providing a workpiece, and forming a protective material over a bottom surface and edges of the workpiece. A top surface of the workpiece is processed. The protective material protects the edges and the bottom surface of the workpiece during the processing of the top surface of the workpiece.


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