The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2014

Filed:

Jul. 29, 2013
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Yannick Feurprier, Albany, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01); H01L 21/308 (2006.01); H01L 21/768 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/308 (2013.01); H01L 21/76802 (2013.01); H01L 21/76832 (2013.01); H01L 21/31116 (2013.01); H01L 21/31144 (2013.01); H01L 21/76811 (2013.01); H01L 21/76804 (2013.01);
Abstract

A method for profiling a film stack includes receiving a film stack having an insulation layer, a dielectric hard mask layer, and a patterned metal hard mask layer. The pattern in the patterned metal hard mask layer is transferred to the dielectric hard mask layer using a first dry etching process. The pattern in the dielectric hard mask layer is then transferred to the insulation layer using a second dry etching process including one or more halogen-containing gases. The second etching process etches the insulation layer and removes a portion of the patterned metal hard mask layer, which exposes a corner of the underlying dielectric hard mask layer. Portions of the dielectric hard mask layer that overhang the insulation layer are removed using a third dry etching process including a process composition that is more selective to the dielectric hard mask layer relative to the insulation layer.


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