The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2014
Filed:
Aug. 03, 2011
Hsiao-tsung Yen, Tainan, TW;
Yu-ling Lin, Taipei, TW;
Chin-wei Kuo, Zhubei, TW;
Victor Chih Yuan Chang, Hsin-Chu, TW;
Min-chie Jeng, Taipei, TW;
Hsiao-Tsung Yen, Tainan, TW;
Yu-Ling Lin, Taipei, TW;
Chin-Wei Kuo, Zhubei, TW;
Victor Chih Yuan Chang, Hsin-Chu, TW;
Min-Chie Jeng, Taipei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, JP;
Abstract
A method includes providing on a substrate having at least two through substrate vias ('TSVs') a plurality of test structures for de-embedding the measurement of the intrinsic characteristics of a device under test (DUT) including at least two of the TSVs; measuring the intrinsic characteristics [L] for a first and a second test structure on the substrate including two pads coupled with a transmission line of length L; using simultaneous solutions of ABCD matrix or T matrix form equations, and the measured intrinsic characteristics, solving for the intrinsic characteristics of the pads and the transmission lines; de-embedding the measurements of the third and fourth test structures using the intrinsic characteristics of the pads and the transmission lines; and using simultaneous solutions of ABCD matrix or T matrix form equations for BM_L and BM_LX, and the measured intrinsic characteristics, solving for the intrinsic characteristics of the TSVs.