The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2014
Filed:
Jun. 30, 2010
Yi-hsiuan Yu, Taoyuan County, TW;
Bao-yann Lin, Hsinchu County, TW;
Ming-hsiung Wei, Taoyuan County, TW;
Lea-hwung Leu, Taipei, TW;
Gou-hong Yiin, Taipei County, TW;
Chen-chi M MA, Hsinchu, TW;
Yi-Hsiuan Yu, Taoyuan County, TW;
Bao-Yann Lin, Hsinchu County, TW;
Ming-Hsiung Wei, Taoyuan County, TW;
Lea-Hwung Leu, Taipei, TW;
Gou-Hong Yiin, Taipei County, TW;
Chen-Chi M Ma, Hsinchu, TW;
Chung Shan Institute of Science and Technology Armaments Bureau, M.N.D., Taoyuan County, TW;
Abstract
A method for manufacturing a conductive adhesive containing a one-dimensional (1D) conductive nanomaterial is revealed. The method produces a conductive adhesive by mixing the 1D conductive nanomaterial with water-based or solvent-based resin solution. The conductive adhesive has good industrial applications, not influenced by industrial adaptability and environmental adaptability. The conductive adhesive obtained also has better conductivity. Moreover, the amount of the 1D conductive nanomaterial used in the present invention is less than the amount of conductive nanoparticles used and the cost is reduced effectively.