The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2014
Filed:
Jun. 27, 2011
Yohei Igarashi, Nagano, JP;
Yasushi Araki, Nagano, JP;
Yohei Igarashi, Nagano, JP;
Yasushi Araki, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;
Abstract
There is provided a semiconductor package that includes: a wiring board; a first semiconductor chip mounted on the wiring board; a second semiconductor chip mounted on the first semiconductor chip, wherein a size of second semiconductor chip is larger than that of the first semiconductor chip when viewed from a thickness direction of the semiconductor package; an insulating resin provided between the wiring board and the second semiconductor chip and between the wiring board and the first semiconductor chip so as to cover the first semiconductor chip; a base disposed on the wiring board to face a surface of the second semiconductor chip, wherein the insulating resin is provided between the base and the second semiconductor chip so as to cover the base.