The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2014
Filed:
Mar. 23, 2012
Zhe-ju Liu, Pingzhen, TW;
Chih-cherng Jeng, Madou Township, TW;
Kuo-cheng Lee, Tainan, TW;
Szu-hung Yang, Tainan, TW;
Po-zen Chen, Tainan, TW;
Chi-chin Hsu, Tainan, TW;
Zhe-Ju Liu, Pingzhen, TW;
Chih-Cherng Jeng, Madou Township, TW;
Kuo-Cheng Lee, Tainan, TW;
Szu-Hung Yang, Tainan, TW;
Po-Zen Chen, Tainan, TW;
Chi-Chin Hsu, Tainan, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A device includes a semiconductor substrate having a front side and a backside. A photo-sensitive device is disposed on the front side of the semiconductor substrate. A dielectric layer is disposed on the backside of the semiconductor substrate, wherein the dielectric layer is over a back surface of the semiconductor substrate. A metal shield is over the dielectric layer and overlapping the photo-sensitive device. A metal plug penetrates through the dielectric layer, wherein the metal plug electrically couples the metal shield to the semiconductor substrate.