The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8801908 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 12, 2014

Filed:

Jun. 15, 2012
Applicants:

Chuan-li Cheng, Taipei, TW;

Chao-lun Liu, Taipei, TW;

Chih-feng Hsu, Taipei, TW;

Inventors:

Chuan-Li Cheng, Taipei, TW;

Chao-Lun Liu, Taipei, TW;

Chih-Feng Hsu, Taipei, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 28/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A composite insulating layer and a manufacturing method thereof. The composite insulating layer includes a socket substrate, a connection layer disposed on the socket substrate, a conductive metal layer disposed on the connection layer, an insulating metal layer disposed on the conductive metal layer, an insulating ceramic layer disposed on the insulating metal layer, and a electrodeposition layer disposed on the insulating ceramic layer. The composite insulating layer of the present invention can avoid the electromagnetic interference generated from the pins of the CPU and increase the stability of the CPU.


Find Patent Forward Citations

Cheng, Chuan-Li. (2014). Composite insulating layer and manufacturing method thereof (U.S. Patent No. 8801908). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8801908

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