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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8801279 B1

PDFFull Text
Date of Patent:
Aug. 12, 2014

Filed:

Jul. 06, 2011

Semiconductor device with stacked structure having through electrode, semiconductor memory device, semiconductor memory system, and operating method thereof

Applicants:

Jung-sik Kim, Seoul, KR;

Dong-hyuk Lee, Seoul, KR;

Ho-cheol Lee, Yongin-si, KR;

Jang-woo Ryu, Seoul, KR;

Inventors:

Jung-sik Kim, Seoul, KR;

Dong-hyuk Lee, Seoul, KR;

Ho-cheol Lee, Yongin-si, KR;

Jang-woo Ryu, Seoul, KR;

Assignee:

Samsung Electronics Co., Ltd., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:

Muir Patent Consulting, PLLC

Primary Examiner:

Mirellys Jagan

Int. Cl.
CPC ...
H01L 35/00 (2006.01); G01K 13/00 (2006.01); H01L 23/525 (2006.01); G01K 13/10 (2006.01); H01L 25/065 (2006.01); G01K 7/01 (2006.01); H01L 23/34 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5258 (2013.01); H01L 2225/06517 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01055 (2013.01); H01L 2225/06513 (2013.01); G01K 13/10 (2013.01); H01L 2225/06541 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16145 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/01068 (2013.01); G01K 7/01 (2013.01); H01L 24/16 (2013.01); H01L 23/481 (2013.01); H01L 23/34 (2013.01);
Abstract

A semiconductor device, memory device, system, and method of using a stacked structure for stably transmitting signals among a plurality of semiconductor layers is disclosed. The device includes at least a first semiconductor chip including a first temperature sensor circuit configured to output first temperature information related to the first semiconductor chip, and at least one through substrate via.

Find Patent Forward Citations

Kim, Jung-sik. (2014). Semiconductor device with stacked structure having through electrode, semiconductor memory device, semiconductor memory system, and operating method thereof (U.S. Patent No. 8801279). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8801279

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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