The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2014
Filed:
Jun. 09, 2011
Applicant:
Youhong Wu, Ogaki, JP;
Inventor:
Youhong Wu, Ogaki, JP;
Assignee:
IBIDEN Co., Ltd., Ogaki-shi, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacturing a multi-layer printed wiring board including forming a core substrate, forming a first interlayer insulation layer over the core substrate, forming a first filled via in the first interlayer insulation layer, the first filled via having a bottom portion having a first diameter, forming a second interlayer insulation layer over the first interlayer insulation layer, and forming a second filled via in the second interlayer insulation layer, the second filled via having a bottom portion having a second diameter smaller than the first diameter.