The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2014
Filed:
Apr. 23, 2012
Chi-sung OH, Gunpo-si, KR;
Jung-sik Kim, Seoul, KR;
Ho-cheol Lee, Yongin-si, KR;
Jung-bae Lee, Seongnam-si, KR;
Chi-sung Oh, Gunpo-si, KR;
Jung-sik Kim, Seoul, KR;
Ho-cheol Lee, Yongin-si, KR;
Jung-bae Lee, Seongnam-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
Semiconductor devices configured to test connectivity of micro bumps including one or more micro bumps and a boundary scan test block for testing connectivity of the micro bumps by scanning data input to the micro bumps and outputting the scanned data. The semiconductor device may include a first chip including solder balls and at least one or more switches electrically coupled with the respective solder balls, and a second chip stacked on top of the first chip and electrically coupled with the switches in direct access mode, including micro bumps that input/output signals transmitted from/to the solder balls.