The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2014
Filed:
Apr. 22, 2008
Applicants:
KE Chun Liu, Toufen Town, TW;
Kuan-chieh Huang, Hsin-Chu, TW;
Chin-min Lin, Hsin-Chu, TW;
Ken Wen-chien Fu, Hsin-Chu, TW;
Mingo Lin, Hsin-Chu, TW;
Inventors:
Ke Chun Liu, Toufen Town, TW;
Kuan-Chieh Huang, Hsin-Chu, TW;
Chin-Min Lin, Hsin-Chu, TW;
Ken Wen-Chien Fu, Hsin-Chu, TW;
Mingo Lin, Hsin-Chu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit structure includes a substrate and a metallization layer over the substrate. The metallization layer includes a dielectric layer and metal lines in the dielectric layer. The integrated circuit structure further includes a sensing element over the metallization layer. The sensing element may be formed in passivation layers.