The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 29, 2014

Filed:

Nov. 07, 2008
Applicant:

Jacob Chi Wing Leung, Hong Kong, CN;

Inventor:

Jacob Chi Wing Leung, Hong Kong, CN;

Assignee:

Cree Hong Kong Limited, Shatin, New Terriotories, HK;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 23/48 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
Abstract

A multi-chip lighting module is disclosed for maximizing luminous flux output and thermal management. In one embodiment, a multi-chip module device comprises a substantially thermally dissipative substrate with a dark insulating layer deposited on a surface of the substrate. A plurality of light emitting devices is also provided. An electrically conductive layer is applied to a surface of the substrate, with the conductive layer comprising a plurality of chip carrier parts each having a surface for carrying at least one of the light emitting devices. Each light emitting device has a first and a second electrical terminal. A reflective layer is also provided that at least partially covers the conductive layer.


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