The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2014
Filed:
May. 29, 2009
Günther Weichslberger, Graz, AT;
Arno Kriechbaum, Leoben, AT;
Mike Morianz, Graz, AT;
Nikolai Haslebner, Zeltweg, AT;
Johannes Stahr, Bruck, AT;
Fritz Haring, Bruck, AT;
Gerhard Freydl, Leoben, AT;
Andrea Koertvelyessy, Vienna, AT;
Mark Beesley, Leoben, AT;
Andreas Zluc, Fuβach, AT;
Wolfgang Schrittwieser, Kapfenberg, AT;
Günther Weichslberger, Graz, AT;
Arno Kriechbaum, Leoben, AT;
Mike Morianz, Graz, AT;
Nikolai Haslebner, Zeltweg, AT;
Johannes Stahr, Bruck, AT;
Fritz Haring, Bruck, AT;
Gerhard Freydl, Leoben, AT;
Andrea Koertvelyessy, Vienna, AT;
Mark Beesley, Leoben, AT;
Andreas Zluc, Fuβach, AT;
Wolfgang Schrittwieser, Kapfenberg, AT;
AT & S Austria Technologies & Systemtechnik Aktiengesellschaft, Leoben-Hinterberg, AT;
Abstract
This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component () is embedded inside an insulating-material layer () and contacts () are made to connect the component () electrically to the conductor structures () contained in the electronic module. According to the invention, at least one thermal via (), which boosts the conducting of heat away from the component () is manufactured in the insulating-material layer () in the vicinity of the component ().