The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2014

Filed:

Sep. 12, 2012
Applicants:

Ching-feng Lin, Hsinchu County, TW;

Chi-hao Chiu, Hsinchu, TW;

Kun-huang Chang, Hsinchu, TW;

Inventors:

Ching-Feng Lin, Hsinchu County, TW;

Chi-Hao Chiu, Hsinchu, TW;

Kun-Huang Chang, Hsinchu, TW;

Assignee:

Apaq Technology Co., Ltd., Miaoli County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/32 (2006.01);
U.S. Cl.
CPC ...
Abstract

A winding-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The conductive unit includes a winding-type capacitor having a first conductive pin and a second conductive pin. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal electrically connected to the first conductive pin and a second conductive terminal electrically connected to the second conductive pin. The first conductive terminal has a first embedded portion contacting the first conductive pin and enclosed by the package body and a first exposed portion connected to the first embedded portion and exposed from the package body. The second conductive terminal has a second embedded portion contacting the second conductive pin and enclosed by the package body and a second exposed portion connected to the second embedded portion and exposed from the package body.


Find Patent Forward Citations

Lin, Ching-Feng. (2014). Winding-type solid electrolytic capacitor package structure (U.S. Patent No. 8787002). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8787002

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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