The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2014

Filed:

Mar. 30, 2011
Applicants:

Hisakazu Marutani, Kanagawa, JP;

Yasunari Iwami, Kanagawa, JP;

Tomoshige Chikai, Kanagawa, JP;

Tomoko Takahashi, Kanagawa, JP;

Osamu Yamagata, Kanagawa, JP;

Shingo Mitsugi, Kanagawa, JP;

Chunghao Chen, Kanagawa, JP;

Inventors:

Hisakazu Marutani, Kanagawa, JP;

Yasunari Iwami, Kanagawa, JP;

Tomoshige Chikai, Kanagawa, JP;

Tomoko Takahashi, Kanagawa, JP;

Osamu Yamagata, Kanagawa, JP;

Shingo Mitsugi, Kanagawa, JP;

Chunghao Chen, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device comprising a support plate, a semiconductor element mounted on the support plate and including a circuit element surface having a plurality of first electrodes, a first insulation layer covering the circuit element surface of the semiconductor element, and including a plurality of first apertures exposing the plurality of first electrodes, a second insulation layer covering an upper part of the support plate and side parts of the semiconductor element, and wirings formed on an upper part of the first insulation layer and on an upper part of the second insulation layer, and electrically connected to the corresponding first electrodes.


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