The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2014

Filed:

Mar. 11, 2013
Applicant:

Chipmos Technologies Inc., Hsinchu, TW;

Inventor:

Chung-Pang Chi, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H04L 23/528 (2013.01); H01L 24/11 (2013.01); H01L 21/768 (2013.01);
Abstract

A conductive structure for a semiconductor chip and a method for forming the conductive structure are provided. The semiconductor chip comprises a plurality of first pads and second pads. The pad area is defined with a first area, a second area and a third area, wherein the first area is located between the second area and the third area. Each of the first pads and the second pads are interlaced to each other on the first area. The conductive structure comprises a plurality of conductive bumps formed on each of the first pads and the second pads respectively to electrically connect with each of the first pads and the second pads. Each of the conductive bumps has a first bump-width disposed on the first area and a second bump-width disposed on one of the second and third areas in which the first bump-width is shorter than the second bump-width.


Find Patent Forward Citations

Loading…