The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2014
Filed:
Mar. 12, 2013
Advanced Laser Separationinternational (Alsi) N.v., Beuningen, NL;
Karel Maykel Richard Van der Stam, Apeldoorn, NL;
Rogier Evertsen, Arnehm, NL;
Guido Martinus Henricus Knippels, Schijndel, NL;
ASM Technology Singapore Pte. Ltd., Singapore, SG;
Abstract
A method of singulating a semiconductor wafer having two surfaces separated by a thickness T<200 μm includes partitioning it along a network of scribelines on one side. The other side is secured to an elastic foil, which is clamped to a wafer table. A radiative scribing tool is used to produce at least one laser beam having a pulse duration P≦75 ps, and causing the laser beam to scan along each of the scribelines so as to create a scribe with a depth D<T, thereby leaving the second surface intact. The foil is laterally stretched to sever the second major surface along the path of the scribes. In an embodiment, P<C, the Time Constant of phonon-phonon coupling in the wafer at the location of incidence of the laser beam.