The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2014
Filed:
Aug. 30, 2007
Toshiyuki Yokomae, Matsumoto, JP;
Katsumichi Ueyanagi, Matsumoto, JP;
Eiji Mochizuki, Nagano, JP;
Yoshinari Ikeda, Matsumoto, JP;
Toshiyuki Yokomae, Matsumoto, JP;
Katsumichi Ueyanagi, Matsumoto, JP;
Eiji Mochizuki, Nagano, JP;
Yoshinari Ikeda, Matsumoto, JP;
Fuji Electric Co., Ltd., Kawasaki-shi, JP;
Abstract
A semiconductor apparatus equipped with at least one semiconductor element includes a metallic plate bonded to an upper surface of the semiconductor element and a conductor plate, bonded to the metallic plate and serving as an electric current path of the semiconductor apparatus. The conductor plate and the metallic plate are bonded to each other by laser welding at a part other than a part directly above the semiconductor element. As a result, heat damage caused by laser welding can be reduced.