The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2014
Filed:
Aug. 27, 2012
Applicants:
Klaus Pressel, Regensburg, DE;
Gottfried Beer, Nittendorf, DE;
Inventors:
Klaus Pressel, Regensburg, DE;
Gottfried Beer, Nittendorf, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); B81B 7/02 (2006.01); G01L 9/00 (2006.01); B81C 1/00 (2006.01); H01L 21/56 (2006.01); H01L 25/16 (2006.01); H01L 21/683 (2006.01); H01L 23/31 (2006.01); G01P 1/02 (2006.01); H01L 25/00 (2006.01); H04R 1/04 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
G01P 1/023 (2013.01); H01L 2924/01072 (2013.01); H01L 24/97 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/01087 (2013.01); H01L 2224/76155 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/12044 (2013.01); H01L 23/5389 (2013.01); B81B 7/02 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01079 (2013.01); H01L 2224/82039 (2013.01); H01L 2224/24137 (2013.01); H01L 2223/6677 (2013.01); H01L 24/96 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/15174 (2013.01); H01L 2224/97 (2013.01); H04R 1/04 (2013.01); H04R 2201/003 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01033 (2013.01); G01L 9/0042 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/14 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01029 (2013.01); B81C 1/0023 (2013.01); H01L 21/568 (2013.01); H01L 25/16 (2013.01); H01L 2924/014 (2013.01); B81C 2203/0154 (2013.01); H01L 2924/01082 (2013.01); H01L 21/6835 (2013.01); H01L 2924/15311 (2013.01); H01L 23/3128 (2013.01); B81B 2207/095 (2013.01); H01L 23/5384 (2013.01); H01L 2924/01013 (2013.01); H01L 23/49816 (2013.01); H01L 2924/00013 (2013.01); B81B 2207/092 (2013.01); H01L 2924/12041 (2013.01); H01L 25/50 (2013.01);
Abstract
A semiconductor device and manufacturing method. One embodiment provides a semiconductor chip. An encapsulating material covers the semiconductor chip. A metal layer is over the semiconductor chip and the encapsulating material. At least one of a voltage generating unit and a display unit are rigidly attached to at least one of the encapsulating material and the metal layer.