The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2014
Filed:
Mar. 19, 2008
Applicants:
Seong BO Shim, Icheon, KR;
Taewoo Kang, Suwon-si, KR;
Yong Hee Kang, Icheon, KR;
Inventors:
Assignee:
STATS ChipPAC Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/12 (2006.01); H01L 23/34 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/40 (2006.01); H01L 23/28 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A stackable integrated circuit package system including mounting an integrated circuit device over a package carrier, mounting a stiffener over the package carrier and mounting a mountable package carrier over the stiffener with a vertical gap between the integrated circuit device and the mountable package carrier.