The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2014
Filed:
Mar. 15, 2011
Kazuyoshi Sakurai, Kawaguchi, JP;
Yuichi Noguchi, Kawaguchi, JP;
Norio Kurokawa, Kawaguchi, JP;
Yasuo Tane, Yokkaichi, JP;
Kazuyoshi Sakurai, Kawaguchi, JP;
Yuichi Noguchi, Kawaguchi, JP;
Norio Kurokawa, Kawaguchi, JP;
Yasuo Tane, Yokkaichi, JP;
Kyocera Chemical Corporation, Kawaguchi-shi, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
In a forming method of an adhesive layer including the steps of selectively coating, on a surface to be bonded, an adhesive composition containing a thermosetting composition and an organic solvent using a noncontact coating device; and removing the organic solvent from the adhesive composition coated on the surface to be bonded and in a forming method of an adhesive layer characterized in the thermosetting composition has a hardening property so as to exhibit two kinds of reaction temperatures, the adhesive composition comprising an epoxy resin and an epoxy curing agent which are reacted through a first hardening reaction exhibiting a first DSC peak within a temperature range of 100 to 160° C. and a second hardening reaction relating to a self-polymerization of the epoxy resin and exhibiting a second DSC peak within a temperature range of 140 to 200° C.