The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2014
Filed:
Aug. 13, 2012
Applicant:
Shih-hao Sun, Hsinchu County, TW;
Inventor:
Shih-Hao Sun, Hsinchu County, TW;
Assignee:
Subtron Technology Co., Ltd., Hsinchu County, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A package carrier includes a metal substrate, a pad, a dielectric layer, and a circuit layer. The metal substrate has a first surface and a second surface opposite to the first surface. The pad is disposed on the first surface. The dielectric layer is disposed on the first surface and covers the pad. A thickness of the dielectric layer is less than 150 μm. The circuit layer is embedded in the dielectric layer and connected to the pads.
Sun, Shih-Hao. (2014). Package carrier (U.S. Patent No. 8766463). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8766463
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile