The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2014
Filed:
Jan. 25, 2011
Katsumi Kikuchi, Tokyo, JP;
Shintaro Yamamichi, Tokyo, JP;
Hideya Murai, Tokyo, JP;
Kentaro Mori, Tokyo, JP;
Yoshiki Nakashima, Tokyo, JP;
Daisuke Ohshima, Tokyo, JP;
Katsumi Kikuchi, Tokyo, JP;
Shintaro Yamamichi, Tokyo, JP;
Hideya Murai, Tokyo, JP;
Kentaro Mori, Tokyo, JP;
Yoshiki Nakashima, Tokyo, JP;
Daisuke Ohshima, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A wiring board including a built-in semiconductor element includes the semiconductor element, a peripheral insulating layer covering an outer peripheral side surface of the semiconductor element, an upper surface-side wiring provided on an upper surface side of the wiring board, and a lower surface-side wiring provided on a lower surface side of the wiring board. The semiconductor element includes a first wiring structure layer including a first wiring and a first insulating layer alternately provided on a semiconductor substrate, and a second wiring structure layer including a second wiring and a second insulating layer alternately provided on the first wiring structure layer. The upper surface-side wiring includes a wiring electrically connected to the first wiring via the second wiring. The second wiring is thicker than the first wiring and thinner than the upper surface-side wiring. The second insulating layer is formed of a resin material and is thicker than the first insulating layer.