The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2014
Filed:
Mar. 03, 2011
Applicants:
Peter L. Kellerman, Essex, MA (US);
Dawei Sun, Nashua, NH (US);
Brian Helenbrook, Potsdam, NY (US);
David S. Harvey, Westford, MA (US);
Inventors:
Peter L. Kellerman, Essex, MA (US);
Dawei Sun, Nashua, NH (US);
Brian Helenbrook, Potsdam, NY (US);
David S. Harvey, Westford, MA (US);
Assignee:
Varian Semiconductor Equipment Associates, Inc., Gloucester, MA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C30B 15/06 (2006.01); C30B 15/00 (2006.01); C30B 15/20 (2006.01); C30B 15/22 (2006.01);
U.S. Cl.
CPC ...
C30B 15/00 (2013.01); C30B 15/06 (2013.01); C30B 15/20 (2013.01); C30B 15/22 (2013.01);
Abstract
Embodiments related to sheet production are disclosed. A melt of a material is cooled to form a sheet of the material on the melt. The sheet is formed in a first region at a first sheet height. The sheet is translated to a second region such that it has a second sheet height higher than the first sheet height. The sheet is then separated from the melt. A seed wafer may be used to form the sheet.