The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2014

Filed:

Aug. 10, 2011
Applicants:

William G. Baron, Springfield, OH (US);

Jeffrey A. Brogan, Stony Brook, NY (US);

Sandra Fries-carr, Dayton, OH (US);

Richard J. Gambino, Port Jefferson, NY (US);

Christopher Gouldstone, Huntington, NY (US);

Brian Keyes, Patchogue, NY (US);

Sanjay Sampath, Setauket, NY (US);

Huey-daw Wu, Stony Brook, NY (US);

Richard L. C. Wu, Beavercreek, OH (US);

Inventors:

William G. Baron, Springfield, OH (US);

Jeffrey A. Brogan, Stony Brook, NY (US);

Sandra Fries-Carr, Dayton, OH (US);

Richard J. Gambino, Port Jefferson, NY (US);

Christopher Gouldstone, Huntington, NY (US);

Brian Keyes, Patchogue, NY (US);

Sanjay Sampath, Setauket, NY (US);

Huey-Daw Wu, Stony Brook, NY (US);

Richard L. C. Wu, Beavercreek, OH (US);

Assignee:

Mesoscribe Technologies, Inc., St. James, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/06 (2006.01); H01G 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A structural capacitor includes a first carbon fiber material layer, a second carbon fiber material layer, and an interlayer dielectric including a diamond-like-carbon material layer.


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