The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2014
Filed:
Apr. 30, 2012
Luke D. Lacroix, Williston, VT (US);
Mark C. H. Lamorey, South Burlington, VT (US);
Janak G. Patel, South Burlington, VT (US);
Peter Slota, Jr., Vestal, NY (US);
David B. Stone, Jericho, VT (US);
Luke D. LaCroix, Williston, VT (US);
Mark C. H. Lamorey, South Burlington, VT (US);
Janak G. Patel, South Burlington, VT (US);
Peter Slota, Jr., Vestal, NY (US);
David B. Stone, Jericho, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An integrated circuit structure includes a plurality of insulator layers (connected to each other) that form a laminated structure. Further included are via openings within each of the insulator layers, and conductive via material within the via openings. The conductive via material within corresponding via openings of adjacent insulator layers are electrically connected to form continuous electrical via paths through the insulator layers between the top surface and the bottom surface of the laminated structure. Within each of the continuous electrical via paths, the via openings are positioned relative to each other to form a diagonal structural path of the conductive via material through the laminated structure. The corresponding via openings of the adjacent insulator layers partially overlap each other. The diagonal structural paths are non-perpendicular to the top surface and the bottom surface.