The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2014
Filed:
Jul. 19, 2012
Charles L. Arvin, Poughkeepsie, NY (US);
Wolfgang Sauter, Hinesburg, VT (US);
Jennifer D. Schuler, Wappingers Falls, NY (US);
Charles L. Arvin, Poughkeepsie, NY (US);
Wolfgang Sauter, Hinesburg, VT (US);
Jennifer D. Schuler, Wappingers Falls, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A solder structure for joining an IC chip to a package substrate, and method of forming the same are disclosed. In an embodiment, a structure is formed which includes a wafer having a plurality of solder structures disposed above the wafer. A ball limiting metallurgy (BLM) layer disposed beneath each of the solder structures, above the wafer. At least one of the plurality of solder structures has a first composition, and at least another of the plurality of solder structures has a second composition.