The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2014
Filed:
Sep. 17, 2011
Eun-kyoung Choi, Gyeonggi-do, KR;
Seyoung Jeong, Suwon-si, KR;
Kwang-chul Choi, Suwon-si, KR;
Tae Hong Min, Gumi-si, KR;
Chungsun Lee, Gunpo-si, KR;
Jung-hwan Kim, Bucheon-si, KR;
Eun-Kyoung Choi, Gyeonggi-do, KR;
SeYoung Jeong, Suwon-si, KR;
Kwang-chul Choi, Suwon-si, KR;
Tae Hong Min, Gumi-si, KR;
Chungsun Lee, Gunpo-si, KR;
Jung-Hwan Kim, Bucheon-si, KR;
Abstract
Provided are a semiconductor package and a method of fabricating the same. In one embodiment, to fabricate a semiconductor package, a wafer having semiconductor chips fabricated therein is provided. A heat sink layer is formed over the wafer. The heat sink layer contacts top surfaces of the semiconductor chips. Thereafter, the plurality of semiconductor chips are singulated from the wafer.