The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2014
Filed:
May. 24, 2011
Kyohei Koutake, Kariya, JP;
Hiromichi Morita, Kariya, JP;
Fumiyoshi Kano, Chiryu, JP;
Tetsuji Yamaguchi, Obu, JP;
Sumitomo Inomata, Toyota, JP;
Masatake Nagaya, Seto, JP;
Kyohei Koutake, Kariya, JP;
Hiromichi Morita, Kariya, JP;
Fumiyoshi Kano, Chiryu, JP;
Tetsuji Yamaguchi, Obu, JP;
Sumitomo Inomata, Toyota, JP;
Masatake Nagaya, Seto, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
In a wafer processing method, an ingot is sliced into a wafer and the wafer is planarized by polishing a surface of the wafer. When the wafer is planarized, the wafer is disposed on a wafer holder and the wafer is rotated, a heat quantity is applied to a portion of the wafer so as to form a reformed layer at the portion of the wafer, and a polishing tool is brought into contact with the portion of wafer while rotating so as to polish the portion of the wafer.