The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2014

Filed:

Jan. 22, 2013
Applicants:

Burton J. Carpenter, Austin, TX (US);

Derek S. Swanson, Austin, TX (US);

Inventors:

Burton J. Carpenter, Austin, TX (US);

Derek S. Swanson, Austin, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes a package substrate having a plurality of conductive elements, each of the conductive elements including a conductive trace and a bond finger positioned at an end of the conductive trace. The bond fingers can be arranged on the package substrate in at least three groups. A first group of the three groups can include a first number of the bond fingers. A third group of the three groups can include a third number of the bond fingers. A second group of the three groups can include an intermediate number of the bond fingers. The intermediate number is between the first and the third numbers. Spacing between the conductive elements along the length of the conductive elements is approximately the same.


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