The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2014
Filed:
Feb. 04, 2012
William Johnstone Ray, Fountain Hills, AZ (US);
Mark David Lowenthal, Gilbert, AZ (US);
Neil O. Shotton, Tempe, AZ (US);
Richard A. Blanchard, Los Altos, CA (US);
Mark Allan Lewandowski, North Port, FL (US);
Kirk A. Fuller, Madison, AL (US);
Donald Odell Frazier, Huntsville, AL (US);
William Johnstone Ray, Fountain Hills, AZ (US);
Mark David Lowenthal, Gilbert, AZ (US);
Neil O. Shotton, Tempe, AZ (US);
Richard A. Blanchard, Los Altos, CA (US);
Mark Allan Lewandowski, North Port, FL (US);
Kirk A. Fuller, Madison, AL (US);
Donald Odell Frazier, Huntsville, AL (US);
NthDegree Technologies Worldwide Inc, Tempe, AA (US);
NASA, an agency of the United States, Washington, DC (US);
Abstract
The present invention provides a method of manufacturing an electronic apparatus, such as a lighting device having light emitting diodes (LEDs) or a power generating device having photovoltaic diodes. The exemplary method includes depositing a first conductive medium within a plurality of channels of a base to form a plurality of first conductors; depositing within the plurality of channels a plurality of semiconductor substrate particles suspended in a carrier medium; forming an ohmic contact between each semiconductor substrate particle and a first conductor; converting the semiconductor substrate particles into a plurality of semiconductor diodes; depositing a second conductive medium to form a plurality of second conductors coupled to the plurality of semiconductor diodes; and depositing or attaching a plurality of lenses suspended in a first polymer over the plurality of diodes. In various embodiments, the depositing, forming, coupling and converting steps are performed by or through a printing process.