The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2014

Filed:

Sep. 09, 2010
Applicants:

Roy C. Nangoy, Santa Clara, CA (US);

Saravjeet Singh, Santa Clara, CA (US);

Jon C. Farr, Vallejo, CA (US);

Sharma V. Pamarthy, Fremont, CA (US);

Ajay Kumar, Cupertino, CA (US);

Inventors:

Roy C. Nangoy, Santa Clara, CA (US);

Saravjeet Singh, Santa Clara, CA (US);

Jon C. Farr, Vallejo, CA (US);

Sharma V. Pamarthy, Fremont, CA (US);

Ajay Kumar, Cupertino, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3065 (2006.01); H01J 37/32 (2006.01); C23C 16/455 (2006.01); C23C 16/505 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30655 (2013.01); H01L 21/3065 (2013.01); H01L 21/67069 (2013.01); H01J 37/321 (2013.01); H01J 37/3211 (2013.01); H01J 37/3244 (2013.01); H01J 37/32449 (2013.01); H01J 37/3222 (2013.01); H01J 37/32458 (2013.01); C23C 16/45508 (2013.01); C23C 16/45563 (2013.01); C23C 16/45574 (2013.01); C23C 16/45587 (2013.01); C23C 16/45591 (2013.01); C23C 16/505 (2013.01);
Abstract

Embodiments of the present invention relate to method and apparatus for providing processing gases to a process chamber with improved plasma dissociation efficiency. One embodiment of the present invention provides a baffle nozzle assembly comprising an outer body defining an extension volume connected to a processing chamber. A processing gas is flown to the processing chamber through the extension volume which is exposed to power source for plasma generation.


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