The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2014
Filed:
Feb. 27, 2008
Yoshikazu Oshika, Chiyoda-ku, JP;
Munenori Hashimoto, Chiyoda-ku, JP;
Masayuki Nakano, Chiyoda-ku, JP;
Yoshikazu Oshika, Chiyoda-ku, JP;
Munenori Hashimoto, Chiyoda-ku, JP;
Masayuki Nakano, Chiyoda-ku, JP;
Dowa Electronics Materials Co., Ltd., Tokyo, JP;
Abstract
A solder layer and an electronic device bonding substrate having high bonding strength of a device and low bonding failure even by a simplified bonding method of a device to a substrate and a method for manufacturing the same are provided. A device bonding substrateincluding a substrateand a lead free solder layerformed on said substrate has a solder layerconsisting of a plurality of layers having mutually different phases, and oxygen concentration on the upper surface of the solder layer is lower than 30 atomic % of the concentration of the metal component which is the most oxidizable among the metal components making up the upper layer of the solder layer. Carbon concentration on the upper surface of the solder layermay be lower than 10 atomic % of the concentration of the metal component which is the most oxidizable among the metal components making up the upper layer of the solder layer.