The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2014
Filed:
Feb. 13, 2013
Weng F Yap, Phoenix, AZ (US);
Lai Cheng Law, Selangor, MY;
Boh Kid Wong, Perak, MY;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
Methods relating to intermetallic compound testing of copper-based wire bonds are provided. For example, a method is generally provided for testing the integrity of wire bonds formed between copper-containing wires and the bond pads of a plurality of microelectronic devices. In one embodiment, the method includes selecting at least one wire bond sample produced in conjunction with the wire bonds formed between the copper-containing wires and the bond pads of the microelectronic devices. One or more copper-containing wires of the wire bond sample are contacted with a liquid copper etchant, which contains a sulfate-based oxidizing agent dissolved in a solvent, to cause separation of the copper-containing wires from the bond pads and exposure of the underlying wire-pad interfaces. Intermetallic compounds formed at the exposed wire-pad interfaces are then measured to assess the integrity of the wire bonds.