The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2014
Filed:
Mar. 23, 2012
Yasuyuki Sonoda, Yokohama, JP;
Kyoichi Suguro, Yokohama, JP;
Masatoshi Yoshikawa, Yokohama, JP;
Koji Yamakawa, Tokyo, JP;
Katsuaki Natori, Yokohama, JP;
Daisuke Ikeno, Yokohama, JP;
Yasuyuki Sonoda, Yokohama, JP;
Kyoichi Suguro, Yokohama, JP;
Masatoshi Yoshikawa, Yokohama, JP;
Koji Yamakawa, Tokyo, JP;
Katsuaki Natori, Yokohama, JP;
Daisuke Ikeno, Yokohama, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
According to one embodiment, a method of manufacturing a semiconductor device, the method includes forming a pillar on a base layer, forming a insulating layer on the base layer to cover the pillar by using GCIB method, where a lowermost portion of an upper surface of the insulating layer is lower than an upper surface of the pillar, and polishing the insulating layer and the pillar to expose a head of the pillar by using CMP method, where an end point of the polishing is the lowermost portion of the upper surface of the insulating layer.