The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2014
Filed:
Nov. 29, 2011
Ming-fan Tsai, Taichung, TW;
Hsin-hung Lee, Taichung, TW;
Bo-shiang Fang, Taichung, TW;
Li-fang Lin, Taichung, TW;
Ming-Fan Tsai, Taichung, TW;
Hsin-Hung Lee, Taichung, TW;
Bo-Shiang Fang, Taichung, TW;
Li-Fang Lin, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
An interconnecting mechanism is provide, which includes paired first sub-interconnecting mechanisms and paired second sub-interconnecting mechanisms. The first pair of sub-interconnecting mechanisms includes first and second axially symmetrical spiral conductive elements. The second pair of sub-interconnecting mechanisms includes third and fourth axially symmetrical spiral conductive elements. Configuring the pairs of sub-interconnecting mechanisms in a differential transmission structure having a spiral shape is used to avert sounds and noise signals between different chips or substrates caused by a miniaturizing fabrication process or an increased wiring density.