The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2014
Filed:
Oct. 19, 2010
Kyung Taeg Han, Gyunggi-Do, KR;
IN Tae Yeo, Seoul, KR;
Hun Joo Hahm, Gyunggi-Do, KR;
Chang Ho Song, Seoul, KR;
Seong Yeon Han, Gwangju, KR;
Yoon Sung NA, Gyunggi-Do, KR;
Dae Yeon Kim, Gyunggi-Do, KR;
Ho Sik Ahn, Incheon, KR;
Young Sam Park, Seoul, KR;
Kyung Taeg Han, Gyunggi-Do, KR;
In Tae Yeo, Seoul, KR;
Hun Joo Hahm, Gyunggi-Do, KR;
Chang Ho Song, Seoul, KR;
Seong Yeon Han, Gwangju, KR;
Yoon Sung Na, Gyunggi-Do, KR;
Dae Yeon Kim, Gyunggi-Do, KR;
Ho Sik Ahn, Incheon, KR;
Young Sam Park, Seoul, KR;
Samsung Electronics Co., Ltd., Suwon-Si, KR;
Abstract
An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.