The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2014
Filed:
Jan. 18, 2012
Masato Miyatake, Ibaraki, JP;
Tomohiko Kotake, Ibaraki, JP;
Shunsuke Nagai, Ibaraki, JP;
Shintaro Hashimoto, Ibaraki, JP;
Yasuo Inoue, Ibaraki, JP;
Shin Takanezawa, Ibaraki, JP;
Hikari Murai, Ibaraki, JP;
Masato Miyatake, Ibaraki, JP;
Tomohiko Kotake, Ibaraki, JP;
Shunsuke Nagai, Ibaraki, JP;
Shintaro Hashimoto, Ibaraki, JP;
Yasuo Inoue, Ibaraki, JP;
Shin Takanezawa, Ibaraki, JP;
Hikari Murai, Ibaraki, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
Disclosed are a resin composition containing (a) a maleimide compound having at least two N-substituted maleimide groups in a molecular structure and (b) a silicone compound having at least one reactive organic group in a molecular structure thereof; and a prepreg using the same, a laminate, and a printed wiring board. A resin composition having excellent heat resistance and low thermal expansion properties; and a prepreg, a laminate, and a printed wiring board using the same can be provided.