The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2014

Filed:

Feb. 10, 2012
Applicants:

Bindiganavale S. Nataraj, Cupertino, CA (US);

John Zimmer, Gilroy, CA (US);

Sandeep Khanna, Los Altos, CA (US);

Vinay Iyengar, Cupertino, CA (US);

Chetan Deshpande, San Jose, CA (US);

Inventors:

Bindiganavale S. Nataraj, Cupertino, CA (US);

John Zimmer, Gilroy, CA (US);

Sandeep Khanna, Los Altos, CA (US);

Vinay Iyengar, Cupertino, CA (US);

Chetan Deshpande, San Jose, CA (US);

Assignee:

NetLogic Microsystems, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 15/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A CAM device is disclosed that includes an array of CAM cells in which the compare circuits of groups of CAM cells are connected together using a conductive layer interposed between a polysilicon layer of the CAM device and the metal-layer of the CAM device. This allows the data lines (e.g., the bit lines and/or comparand lines) of the CAM array to be formed in the metal-layer of the CAM device, which in turn allows the match lines of the CAM array to be formed in the metal-layer of the CAM device. The conductive layer, which may be a silicide layer, is connected to the match line by a via extending from the conductive layer through the metal-layer to the metal-layer.


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