The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2014
Filed:
Jul. 30, 2010
Applicant:
Sang-yun Lee, Beaverton, OR (US);
Inventor:
Sang-Yun Lee, Beaverton, OR (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor structure includes an interconnect region, and a material transfer region coupled to the interconnect region through a bonding interface. The semiconductor structure includes a capping layer sidewall portion which extends annularly around the material transfer region and covers the bonding interface. The capping layer sidewall portion restricts the flow of debris from the bonding interface.