The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2014
Filed:
Dec. 11, 2008
Harry Chandra, Mountain House, CA (US);
Flynn Carson, Redwood City, CA (US);
Harry Chandra, Mountain House, CA (US);
Flynn Carson, Redwood City, CA (US);
Stats Chippac Ltd., Singapore, SG;
Abstract
An integrated circuit package system includes: forming a base stacking package including: fabricating a base substrate, mounting an integrated circuit on the base substrate, positioning an input/output expansion substrate, having access ports around an inner array area, over the integrated circuit, and injecting a molding compound on the base substrate, the integrated circuit, and the input/output expansion substrate; and mounting a top package on the input/output expansion substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile