The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2014
Filed:
Aug. 23, 2012
Toshiaki Yonezu, Tokyo, JP;
Takeshi Iwamoto, Tokyo, JP;
Shigeki Obayashi, Tokyo, JP;
Masashi Arakawa, Tokyo, JP;
Kazushi Kono, Tokyo, JP;
Toshiaki Yonezu, Tokyo, JP;
Takeshi Iwamoto, Tokyo, JP;
Shigeki Obayashi, Tokyo, JP;
Masashi Arakawa, Tokyo, JP;
Kazushi Kono, Tokyo, JP;
Renesas Electronics Corporation, Kawasaki-shi, JP;
Abstract
A semiconductor integrated circuit which can perform reliable relief processing using an electric fuse. The semiconductor integrated circuit includes a fuse wiring, a first electrode pad, a second electrode pad, a pollution-control layer, and a first via hole wiring and a second via hole wiring. The fuse wiring is cut by current exceeding a predetermined value. A first electrode pad is connected to one side of a fuse wiring, a second electrode pad is connected to the other of a fuse wiring, a pollution-control layer is formed in the upper layer and the lower layer of the fuse wiring via an insulating layer. In the fuse wiring, second via hole wiring of a pair is formed in the outside of a first via hole wiring so that the first the via hole wiring is surrounded.