The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2014

Filed:

May. 24, 2012
Applicant:

Rie Arai, Nagano, JP;

Inventor:

Rie Arai, Nagano, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wiring substrate includes a substrate body formed of an inorganic material and including a first surface and a second surface, a first trench formed in a first surface side of the substrate body, a second trench formed in a second surface side of the substrate body, a penetration hole penetrating through the substrate body, a first plane layer filling the first trench, a second plane layer filling the second trench, and a penetration wiring filling the penetration hole. The first plane layer is a reference potential layer. The second plane layer is a power supply layer.


Find Patent Forward Citations

Arai, Rie. (2014). Wiring substrate and method for manufacturing wiring substrate (U.S. Patent No. 8723051). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8723051

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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